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*Zu"g
SPDTXCb
CXG1199UR
ST--v*Ep"r
CXG1199URI*C SPDT (Single Pole Dual Throw) XCbA*COEg`N"db*C 'p*[COEX'E*MVXeE"KAU**B \j*[ JPHEMTv*ZXEaee*C'a`}"uZAOEAU**B (--p"r*FOEg`N"db*C BluetoothaeN WLAN) BluetoothaeN WLAN"TMI
"A'**E@"\
*OE^pbP*[W*F
12-pin UQFN (2.0mm x 2.0mm x 0.6mm (Max.))
*\`
GaAs JPHEMT MMIC
*a`IAa'eSi
(Ta = 25C) Vctl Topr -35 * -40 * Tstg -65 * 5 +85 +85 +150 V
C C C
(e"E--p"r
) WLAN--p )
(Bluetooth *
Zaee '*OZ- -{ ICI*A"dCIeZo a*foCXE I A*CZaee E"A '*O K--vA **B *U e A eU *K Si"TM I , u--C I1/2 --\ * , L*U"a--eESO* e*HAE*S--LOE IZA {-`oa , nH--aL*U eA e* , ec IZg--p*aIZQ*lAE A , "-ZIe*O O"C* Un*B E *I *X*e AE eU *I A , I`1/4 OE--E`I* e*UO"F 1/2 a IA I eU n*B , `a*\"IE--p--aZ| 1/2aI A* , --*- 3/4 *B , e cnH -{ Z` --EL U1/2-{Z`--E aeA A EZ`--'E IZg--pENo*e`SQE A A
-1-
J05X11-PS
CXG1199UR
u*bN*}^nH
RF1
GND CRF
GND
6
5
4
GND
7
3
GND
F1 RF2 CRF F3 8
F2 2 CRF F4 RF3
GND
9
1
GND
10 Cbypass (100pF)
11
12 Cbypass (100pF) Rctl (1k)
Rctl (1k)
CTLA
GND
CTLB
-{ ICIZg--pZEI*CEISO*t*"i*K--vA**B *@ Rctl*FI'i*RI*A"d-"xu`P--pA**B*'lI RFfJbvS"O--pA**B`SAIAvSP*[V"EZg--pA*B CRF*FI--e--EI *@ Cbypass*FI--e--EI DCC"ItB^S"O--pA**B*'lI
1k 100pFA*
*^--*'l*\
CTLA L H CTLB H L ON OEoH RF1 - RF2 RF1 - RF3 F1 ON OFF F2 OFF ON F3 OFF ON F4 ON OFF
DCoCAX*OE
(Ta = 25C) *-U Vctl (H)*1 Vctl (H)*2 Vctl (L)
*1 *2
*A'l
*W*'l 2.0 1.65 0
*A`a'l 2.8 1.8 --
'PE 3.6 1.95 0.4
*OE V V V Pin = 15dBm Pin = 5dBm --
e"E--p"r Bluetooth & WLAN
-2-
CXG1199UR
"dC"IA*
1. "dC"IA*
(Ta = 25C)
(e"E--p"r
)
0.5* RF1 - RF2 IL RF1 - RF3 1.0* 2.0* 0.5*
1.0GHz 2.0GHz 2.5GHz 1.0GHz
-- -- -- -- -- -- 25 25 20 25 25 20 -- -- -- -- 50
0.20 0.25 0.35 0.20 0.25 0.35 32 31 27 32 31 27 1.2 1.2 1.2 2
0.30 0.35 0.45 0.30 0.35 0.45 -- -- -- -- -- -- 1.5 1.5 1.5 6
dB dB dB dB dB dB dB dB dB dB dB dB -- -- -- A
1.0* 2.0GHz 2.0* 2.5GHz 0.5* 1.0GHz
RF1 - RF2 AC\OE*[V" ISO. RF1 - RF3
1.0* 2.0GHz 2.0* 2.5GHz 0.5* 1.0* 2.0* 0.5* 1.0GHz 2.0GHz 2.5GHz 1.0GHz 2.0GHz 2.5GHz
VSWR
VSWR
--
1.0* 2.0*
R"g*["d-- 'E*OEF
Ictl
--
Vctl = 2.8V RF|*[gI
Pin = 15dBm, Vctl (H) = 2.8V, Vctl (L) = 0V, `SAI
2. "dC"IA*
(Ta = 25C) *-U `}"uZ
(Bluetooth *
WLAN)
L* IL
OEoH RF1 - RF2 RF1 - RF3 RF1 - RF2 RF1 - RF3 -- -- --
*OE
*A'l
*W*'l
*A`a'l
'PE -- -- 20 20 -- -- -- 0.35 0.35 27 27 1.2 1 0.1 0.50 0.50 -- -- 1.5 3 1 dB dB dB dB -- A s
2.0* 2.5GHz 2.0* 2.5GHz 2.0* 2.0* 2.0* 2.5GHz 2.5GHz 2.5GHz
AC\OE*[V" VSWR R"g*["d-- XCb"O`"x 'E*OEF
ISO. VSWR Ictl TSW
Vctl = 1.8V
Pin = 5dBm, Vctl (H) = 1.8V, Vctl (L) = 0V, `SAI
RF|*[gI
50
-3-
CXG1199UR
SOOE*-@}
('PE*F mm)
12PIN UQFN (PLASTIC)
x4 0.1 2.0 0.55 0.05 0.4 0.1 0.6 9 10 7 6 2.0
0.
S
A-B
C
4-R0.2
C B
A
12 1 3
4
0.4 PIN 1 INDEX 0.18 0.07 0.25 0.05 M S A-B C
0.14
26
0.05
S
S
Solder Plating + 0.09 0.14 - 0.03 + 0.09 0.25 - 0.03
MAX0.02
SPEC.
S
TERMINAL SECTION
Note:Cutting burr of lead are 0.05mm MAX.
SONY CODE EIAJ CODE JEDEC CODE UQFN-12P-01
PACKAGE STRUCTURE
PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.01g
LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS
COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18m
-4-
Sony Corporation

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